ELSPES Inc. announced that its silicon deep trench capacitor (DTC) have successfully passed qualification testing in accordance with MIL-PRF-32535, the U.S. military performance specification for fixed non-electrolytic capacitors used in defense and aerospace applications.

The qualification testing was independently conducted by QRT Inc., a certified reliability testing laboratory, with the report issued on April 28, 2026. Across all 16 test categories — covering mechanical, thermal, electrical, and radiation hardness requirements — the ELSPES DTC passed all tests, demonstrating exceptional reliability and robustness under the most demanding conditions. Detailed test conditions and results are summarized in the qualification test table below.

Table 1. ELSPES DTC qualification test results

Of particular significance are the radiation hardness results, with Total Ionizing Dose (TID) tolerance verified for 300 krad(Si) and with Single Event Effect (SEE) safe operating verified up to 61.3 MeV-cm²/mg, confirming ELSPES DTCs are well-suited for space, satellite, and high-radiation environments.

This milestone, passing MIL-PRF-32535 qualification testing, builds on ELSPES's existing AS9100D / EN 9100:2018 and ISO 9001:2015 certification, which covers the design, development, and project management for manufacturing of silicon capacitors. Together, these credentials establish ELSPES as a fully quality-managed, independently validated supplier capable of meeting the most demanding requirements of the global defense, aerospace, and space supply chain. For system integrators and prime contractors seeking a reliable, high-performance silicon capacitor source outside of traditional MLCC supply chains, ELSPES represents a compelling alternative.

ELSPES Inc. was proud to participate as an exhibitor at Mobile World Congress (MWC) Barcelona 2026, held from March 2–5 at Fira Gran Via, Barcelona, Spain — the world's largest and most influential event for the connectivity ecosystem. Joining over 2,900 exhibitors and more than 109,000 attendees from 205 countries, ELSPES showcased its advanced silicon capacitor solutions tailored for next-generation RF and wireless applications, including 5G and 6G infrastructure.

Under this year's theme "The IQ Era", ELSPES engaged with leading OEMs, network operators, and technology partners, highlighting how our high-reliability silicon capacitors play a critical role in enabling the performance and miniaturization demands of modern connectivity hardware. The event provided a valuable platform to strengthen existing partnerships and explore new opportunities in the rapidly evolving global wireless market.

We thank everyone who visited our booth and look forward to continuing these conversations.

ELSPES Inc. was pleased to participate as an exhibitor at DesignCon 2026, held from February 24–26 at the Santa Clara Convention Center, Santa Clara, California — the premier high-speed communications and system design conference and exposition in the heart of Silicon Valley.

DesignCon brought together chip, board, and systems design professionals to explore the latest technologies, tools, and industry trends shaping electronics engineering. ELSPES joined hundreds of exhibitors to showcase our silicon deep trench capacitor solutions, with a focus on their role in high-speed signal and power integrity applications. The event offered an exceptional opportunity to connect with engineers and technology leaders working on next-generation PCB design, high-speed interconnects, and advanced semiconductor architectures — all areas where ELSPES silicon capacitors deliver critical performance advantages.

We engaged in meaningful technical discussions with design engineers and system architects, reinforcing ELSPES's position as a trusted component partner for demanding high-frequency and high-reliability applications. We thank all visitors who stopped by our booth and look forward to seeing you at future events.

We are proud to announce that ELSPES Inc. has been officially certified under EN 9100:2018 (equivalent to AS9100D) and ISO 9001:2015 by BSI, one of the world's leading certification bodies.

This certification, covering the design, development, and project management for manufacturing of silicon capacitors, reflects our unwavering commitment to quality, reliability, and continuous improvement in everything we do.

The AS9100D standard is the internationally recognized Quality Management System (QMS) for the aerospace and defense industry — a benchmark that demands the highest level of rigor in processes, traceability, and risk management. Achieving this certification alongside ISO 9001:2015 affirms that ELSPES operates at a world-class level of quality assurance.

Certificate Number: FM 838564 Valid through: February 8, 2029

We thank our team and partners for their dedication in making this milestone possible. This certification strengthens our position as a trusted supplier for high-reliability applications across aerospace, defense, and advanced RF markets.

ELSPES is pleased to announce that our Project Leader, Wisnu Murti, will deliver a presentation at the upcoming PwrSOC 2025 Conference, scheduled for September 26.
His talk, “Enabling Advanced Integration with Deep Trench Silicon Capacitors,” will introduce ELSPES’s proprietary DTC technology and highlight its advantages in next-generation power delivery networks and high-performance systems.
This presentation will also outline ELSPES’s roadmap toward achieving 3,500 nF/mm² capacitance density and advanced customizable capacitor solutions.
Stay tuned as ELSPES continues to drive innovation in power integrity solutions for advanced packaging and SoC environments.

ELSPES is pleased to announce its participation as an exhibitor at the Advanced Semiconductor Packaging & Chiplet Show (ASPS) 2025, taking place from August 27–29, 2025, at the Suwon Convention Center, Korea.

ASPS is Korea’s premier B2B exhibition dedicated to semiconductor packaging and chiplet technologies, bringing together global leaders in advanced packaging, hybrid bonding, and heterogeneous integration. With over 150 companies and 10,000 visitors expected, the event serves as a major hub for industry collaboration and innovation.

At ASPS 2025, ELSPES will showcase its high-density silicon capacitor solutions, designed to address the growing power delivery challenges in AI, high-performance computing (HPC), and next-generation semiconductor platforms. In addition, ELSPES will highlight its capability in High-Speed I/O AC Coupling Capacitors, which ensure signal integrity by blocking DC offsets while enabling stable high-frequency data transmission—an essential requirement for advanced interfaces such as SerDes, optical transceiver modules (TOSA/ROSA), and antenna systems. ELSPES’s proprietary technology delivers ultra-low leakage, superior stability, and scalable integration capability, making it an ideal enabler for advanced packaging and chiplet architectures.

Through this exhibition, ELSPES looks forward to engaging with global semiconductor manufacturers, OSATs, and system companies to explore opportunities for collaboration and to demonstrate how ELSPES technology can contribute to the future of efficient, reliable, and high-performance power delivery systems.

▼ Booth Layout: A110, located along the right-hand wall from the main entrance

We are pleased to announce that ELSPES has been honored as one of the three exemplary companies among the 2025 “Baby Unicorn” selections, as recognized by the Ministry of SMEs and Startups (MSS) of South Korea.

The recognition was made official during the Baby Unicorn Performance Sharing Conference & Certificate Ceremony, held on June 12 at EL Tower in Seoul. This annual event highlights the outstanding growth trajectories of early-stage ventures poised to become Korea’s next-generation unicorns.

ELSPES was honored for its contributions to the development of silicon capacitor technologies in support of AI semiconductor platforms, and for its alignment with Korea’s national focus on advancing global AI competitiveness. This recognition is particularly meaningful as over 86% of this year’s selected companies operate in deep tech sectors such as artificial intelligence and big data—industries seeing exponential global demand and attention.

As a company that contributes to the advancement of core components for AI-based power delivery systems, ELSPES’s inclusion as a national success case reflects both our technical leadership and market potential. This momentum validates our commitment to enabling next-generation semiconductor performance through embedded, high-density silicon capacitors tailored for high-performance computing.

We extend our gratitude to the Ministry and supporting institutions for their trust, and we look forward to continuing our journey toward global leadership.

ELSPES recently participated in the SWTest 2025 Conference held in Carlsbad, California, where global leaders in semiconductor wafer testing gathered to explore next-generation testing solutions.

Throughout the event, ELSPES engaged with a wide range of test equipment companies and observed a high level of interest in test optimization tools tailored to AI-driven applications. Discussions centered around streamlining test processes in response to increasing demand for performance and integration.

Particularly in areas such as advanced packaging, embedding, and TSV (Through-Silicon Via), ELSPES’s silicon capacitor technology received enthusiastic responses from industry professionals. Many expressed strong interest in the feasibility and integration of our solutions into high-density, next-generation packages, affirming the potential impact of our technology in future applications.

We expect the feedback and insights gained through this conference to contribute meaningfully to our continued development and collaborations within the test ecosystem.